Rudolph lithography system selected for first panel fan-out packaging manufacturing line

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Rudolph Technologies Inc. announced recently that an outsourced assembly and test facility has placed an order for the JetStep Lithography System for the semiconductor advanced packaging industry’s first panel manufacturing line.The JetStep system will be used for next-generation fan-out processing on rectangular panels and will ship in mid-2016.

“We view the move from reconstituted wafers to chips-on-panels as a logical and necessary transition in the advanced packaging industry as product volumes increase. We are pleased that our lithography and panel solutions are able to play an integral role in this transition and look forward to partnering with these early leaders,” Mike Plisinski, Rudolph CEO, said in a statement.

“Building on more than 25 years of flat panel lithography experience, we are confident the JetStep Lithography System is a premier solution for advanced packaging panel manufacturing,” Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group, said in a statement.

“We have an established market presence in both fan-out wafer level packaging and radio frequency devices, which we believe will be transitioning to glass panel interposers. Our early success in advanced packaging allows us to bring a wealth of experience and knowledge to this emerging industry shift from wafers to panels. As we have partnered with our wafer customers, Rudolph will partner with panel customers, leveraging our broad range of products and resulting application expertise to not only provide lithography, but a comprehensive solution that will significantly contribute to enabling advanced packaging on panels,” Plisinski said in a statement.